PHOTONIC INTEGRATED CIRCUIT PACKAGES
According to an embodiment of the present invention, an optical integrated circuit package comprises: a first substrate where a first mirror and an optical coupling element spaced apart from the first mirror are disposed; and a second substrate which is disposed on an upper part of the first substra...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | According to an embodiment of the present invention, an optical integrated circuit package comprises: a first substrate where a first mirror and an optical coupling element spaced apart from the first mirror are disposed; and a second substrate which is disposed on an upper part of the first substrate, and where an electric-optical conversion element outputting an optical signal to the first mirror and a second mirror reflecting the received optical signal reflected from the first mirror to the optical coupling element are disposed. Therefore, an objective of the present invention is to provide the optical integrated circuit package with improved consistency and integration.
본 발명의 실시예에 따른 광 집적 회로 패키지는, 제1 미러 및 제1 미러로부터 이격되어 배치되는 광 커플링 소자가 배치된 제1 기판, 및 제1 기판의 상부에 배치되며, 제1 미러로 광 신호를 출력하는 전광 변환 소자 및 제1 미러로부터 반사되어 수신된 광 신호를 광 커플링 소자로 반사시키는 제2 미러가 배치된 제2 기판을 포함한다. |
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