SUBSTRATE CUTTING DEVICE

According to the present invention, a substrate cutting device comprises: a base part; a stage disposed on the base part, including a top surface and a connection surface perpendicular to the top surface, and having a cell substrate disposed on the top surface; a partition member spaced apart from t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SIM JUNHO, SHIM HYUNGBO, KIM WOONG, NOH SUNGHO, KANG KYUNGWON, LEE HEESUK, KIM TEADONG, HAN JAEKU, KIM BUEM JOON, KIM JIHOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	According to the present invention, a substrate cutting device comprises: a base part; a stage disposed on the base part, including a top surface and a connection surface perpendicular to the top surface, and having a cell substrate disposed on the top surface; a partition member spaced apart from the stage so as to face the connection surface, and supporting the cell substrate; and a discharge part disposed on a bottom side of the cell substrate and discharging gas. Therefore, the present invention provides the substrate cutting device which is capable of effectively removing impurities generated during substrate cutting. 본 발명의 기판 절단 장치에 따르면, 베이스 부, 상기 베이스 부 상에 배치되고, 상면 및 상기 상면과 수직을 이루는 연결면을 포함하며, 상기 상면에 셀 기판이 배치되는 스테이지, 상기 스테이지와 이격되어 상기 연결면과 마주하도록 배치되며 상기 셀 기판을 지지하는 격벽 부재, 상기 셀 기판의 하 측에 배치되고, 기체를 배출하는 배출부를 포함한다.