미끄럼 이동 부재, 및 내연 기관의 미끄럼 이동 부재

미끄럼 이동 부재는, 기재와, 기재 상에 형성된 피막층을 구비한다. 피막층은, 복수의 오스테나이트계 스테인리스강 입자에서 유래되는 강부와, 복수의 구리 입자 또는 구리 합금 입자에서 유래되는 구리부를 갖고, 부끼리가 계면을 통하여 결합되어 있다. This sliding member comprises a substrate, and a coating layer formed on the substrate. The coating layer includes: a steel part derived from a plurality of auste...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MABUCHI YUTAKA, MAHLAIRE JEAN MARIE, ARAI JUNICHI, IZAWA YOSHINORI, BONAY ELODIE, GRENTE CHRISTIAN, SPECHT CAROLINA
Format:	Patent
Sprache:	kor
Schlagworte:	ALLOYS BLASTING CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CYCLICALLY OPERATING VALVES FOR MACHINES OR ENGINES DIFFUSION TREATMENT OF METALLIC MATERIAL ENGINE PLANTS IN GENERAL FERROUS OR NON-FERROUS ALLOYS HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MACHINES OR ENGINES IN GENERAL MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MECHANICAL ENGINEERING METALLURGY PERFORMING OPERATIONS POWDER METALLURGY STEAM ENGINES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WEAPONS WORKING METALLIC POWDER
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	미끄럼 이동 부재는, 기재와, 기재 상에 형성된 피막층을 구비한다. 피막층은, 복수의 오스테나이트계 스테인리스강 입자에서 유래되는 강부와, 복수의 구리 입자 또는 구리 합금 입자에서 유래되는 구리부를 갖고, 부끼리가 계면을 통하여 결합되어 있다. This sliding member comprises a substrate, and a coating layer formed on the substrate. The coating layer includes: a steel part derived from a plurality of austenitic stainless steel particles; and a copper part derived from a plurality of copper particles or copper alloy particles. The parts are bonded via an interface.