SUPERSTRATE AND A METHOD OF USING THE SAME

A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. The body of a superstrate can have bending characteristics that are very suitable to achieve both conformal and planarization behaviors. The body can have the surface and t...

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Bibliographische Detailangaben
Hauptverfasser:	KHUSNATDINOV NIYAZ, LABRAKE DWAYNE L
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. The body of a superstrate can have bending characteristics that are very suitable to achieve both conformal and planarization behaviors. The body can have the surface and the thickness in a range of t_1 to t_2, wherein t_1 = (Pd^4/2Eh)^1/3, t_2 = (5Pd^4/2Eh)^1/3, P is the pressure corresponding to a capillary force between the body and a planarization precursor material, d is a bending distance, E is Young′s modulus for the body, and h is a step height difference between two adjacent regions of a substrate. According to an embodiment of the present invention, the thickness can be selected and used to determine the maximum out-of-plane displacement (w_max) for a conformal behavior is sufficient and that the w_max for a planarization behavior is less than a predetermined threshold. 수퍼스트레이트의 본체는 비균일 토포그래피를 갖는 기판 위에 적응성 평탄화 층을 형성하는데 사용될 수 있다. 수퍼스트레이트의 본체는 등각 및 평탄화 거동 모두를 달성하는 데 매우 적절한 굴곡 특성을 가질 수 있다. 본체는 표면 및 t내지 t범위의 두께를 가질 수 있으며, t= (Pd/2Eh); t= (5Pd/2Eh); P는 본체와 평탄화 전구체 재료 사이의 모세관력에 대응하는 압력이고; d는 굴곡 거리이고; E는 본체의 영 모듈러스이고; h는 기판의 2개의 인접한 구역 사이의 단차 높이 차이이다. 일 실시예에서, 두께는 등각 거동에 대한 최대 평면외 변위(w)가 충분하고, 평탄화 거동에 대한 w가 미리 결정된 임계치 미만인 것을 결정하기 위해 선택 및 사용될 수 있다.