ELECTRONIC DEVICE WITH WATERPROOFING STRUCTURE

According to an embodiment of the present invention, an electronic device includes a frame structure, which includes: an outer metallic portion including a first metal material and forming at least a part of an outer surface of the electronic device; an inner metallic portion including a second meta...

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Bibliographische Detailangaben
Hauptverfasser:	HA YUNSUNG, YOO MIN WOO, HWANG YONGWOOK, JANG YOUNGSOO, LEE MIN SUNG, HWANG JUNGHYEON, HWANG CHANG YOUN, KIM JIHYUN, CHOI BYOUNGHEE, LEE JIN HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:	According to an embodiment of the present invention, an electronic device includes a frame structure, which includes: an outer metallic portion including a first metal material and forming at least a part of an outer surface of the electronic device; an inner metallic portion including a second metal material which is different from the first metal material, and laterally surrounded by the outer metallic portion; and a first inner polymeric portion separated from the inner metallic portion and at least partially, laterally surrounded by the outer metallic portion. The electronic device may further include a wireless communications circuit electrically connected to one portion of the outer metallic portion. In addition, various other embodiments are possible. 본 발명의 일 실시 예에 따른 전자 장치는, 프레임 구조(frame structure)을 포함하고, 상기 프레임 구조는, 제 1 금속 물질을 포함하고 상기 전자 장치의 외면의 적어도 일부를 형성하는 외측 금속부(outer metallic portion)와, 상기 제 1 금속 물질과는 다른 제 2 금속 물질을 포함하고 상기 외측 금속부에 의해 옆으로 둘러싸인(laterally surrounded) 내측 금속부(inner metallic portion), 및 상기 내측 금속부로부터 분리되어 있고 상기 외측 금속부에 의해 적어도 부분적으로 옆으로 둘러싸인 제 1 내측 폴리머부(inner polymeric portion)를 포함하고, 상기 전자 장치는 상기 외측 금속부의 일부분에 전기적으로 연결된 무선 통신 회로를 포함할 수 있다. 이외에도 다양한 다른 실시 예들이 가능하다.