PIPE PROCESSING MACHINE

Provided is a device for processing a pipe using a laser. Two transfer parts are provided for transporting the pipe such that the pipe can be processed in each of the two places, and can move the laser beam irradiation part to selectively process the pipe. In addition, each transfer part has a loadi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	JUN, BYUNG HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a device for processing a pipe using a laser. Two transfer parts are provided for transporting the pipe such that the pipe can be processed in each of the two places, and can move the laser beam irradiation part to selectively process the pipe. In addition, each transfer part has a loading part for loading the pipe to each transfer part such that the device can continuously process the pipe without any down time for loading. Therefore, an objective of the present invention is to provide the pipe laser processing device with improved productivity. 레이저를 이용하여 파이프를 가공하는 장치가 제공된다. 이는 2개소에서 각각 파이프가 가공될 수 있도록 파이프를 이송하는 이송부를 2개 마련하고, 레이저빔 조사부를 이동시켜서 선택적으로 파이프를 가공할 수 있다. 또한, 각 이송부에 각기 파이프를 로딩시키는 로딩부를 각각 구비함으로써, 장치가 로딩을 위한 휴지 시간 없이 연속적으로 파이프를 가공할 수 있다.