LASER bonding apparatus method of bonding semiconductor device and method of fabricating semiconductor package
A laser bonding device is provided. The laser bonding device comprises a chamber having a light transmitting window and capable of receiving a workpiece; a gas supply line connected to the chamber and configured to supply gas at an elevated pressure relative to the outside of the chamber; and a lase...
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| creator | LIM JUN SU SATOSHI INADA |
| description | A laser bonding device is provided. The laser bonding device comprises a chamber having a light transmitting window and capable of receiving a workpiece; a gas supply line connected to the chamber and configured to supply gas at an elevated pressure relative to the outside of the chamber; and a laser generating device disposed outside the chamber and configured to irradiate a workpiece stored in the chamber through the light transmitting window. It is possible to fabricate semiconductor products at low costs.
투광성(transmissive) 윈도우를 갖고 워크피스(workpiece)를 수납할 수 있는 챔버; 상기 챔버에 연결되고, 챔버 외부에 비하여 상승된 압력으로 가스를 공급할 수 있도록 구성된 가스 공급 도관; 및 상기 챔버의 외부에 배치되며, 상기 챔버 내에 수납된 워크피스를 상기 투광성 윈도우를 통하여 조사하도록 구성된 레이저 발생 장치를 갖는 레이저 본딩 장치가 제공된다. |
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투광성(transmissive) 윈도우를 갖고 워크피스(workpiece)를 수납할 수 있는 챔버; 상기 챔버에 연결되고, 챔버 외부에 비하여 상승된 압력으로 가스를 공급할 수 있도록 구성된 가스 공급 도관; 및 상기 챔버의 외부에 배치되며, 상기 챔버 내에 수납된 워크피스를 상기 투광성 윈도우를 통하여 조사하도록 구성된 레이저 발생 장치를 갖는 레이저 본딩 장치가 제공된다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190718&DB=EPODOC&CC=KR&NR=20190085382A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190718&DB=EPODOC&CC=KR&NR=20190085382A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIM JUN SU</creatorcontrib><creatorcontrib>SATOSHI INADA</creatorcontrib><title>LASER bonding apparatus method of bonding semiconductor device and method of fabricating semiconductor package</title><description>A laser bonding device is provided. The laser bonding device comprises a chamber having a light transmitting window and capable of receiving a workpiece; a gas supply line connected to the chamber and configured to supply gas at an elevated pressure relative to the outside of the chamber; and a laser generating device disposed outside the chamber and configured to irradiate a workpiece stored in the chamber through the light transmitting window. It is possible to fabricate semiconductor products at low costs.
투광성(transmissive) 윈도우를 갖고 워크피스(workpiece)를 수납할 수 있는 챔버; 상기 챔버에 연결되고, 챔버 외부에 비하여 상승된 압력으로 가스를 공급할 수 있도록 구성된 가스 공급 도관; 및 상기 챔버의 외부에 배치되며, 상기 챔버 내에 수납된 워크피스를 상기 투광성 윈도우를 통하여 조사하도록 구성된 레이저 발생 장치를 갖는 레이저 본딩 장치가 제공된다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMjzcQx2DVJIys9LycxLV0gsKEgsSiwpLVbITS3JyE9RyE-DyxWn5mYmA9mlySX5RQopqWWZyakKiXkpSErTEpOKMpMTSzCVFyQmZyemp_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NRioKrUvNSSeO8gIwNDSwMDC1NjCyNHY-JUAQCil0N6</recordid><startdate>20190718</startdate><enddate>20190718</enddate><creator>LIM JUN SU</creator><creator>SATOSHI INADA</creator><scope>EVB</scope></search><sort><creationdate>20190718</creationdate><title>LASER bonding apparatus method of bonding semiconductor device and method of fabricating semiconductor package</title><author>LIM JUN SU ; SATOSHI INADA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190085382A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>LIM JUN SU</creatorcontrib><creatorcontrib>SATOSHI INADA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIM JUN SU</au><au>SATOSHI INADA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER bonding apparatus method of bonding semiconductor device and method of fabricating semiconductor package</title><date>2019-07-18</date><risdate>2019</risdate><abstract>A laser bonding device is provided. The laser bonding device comprises a chamber having a light transmitting window and capable of receiving a workpiece; a gas supply line connected to the chamber and configured to supply gas at an elevated pressure relative to the outside of the chamber; and a laser generating device disposed outside the chamber and configured to irradiate a workpiece stored in the chamber through the light transmitting window. It is possible to fabricate semiconductor products at low costs.
투광성(transmissive) 윈도우를 갖고 워크피스(workpiece)를 수납할 수 있는 챔버; 상기 챔버에 연결되고, 챔버 외부에 비하여 상승된 압력으로 가스를 공급할 수 있도록 구성된 가스 공급 도관; 및 상기 챔버의 외부에 배치되며, 상기 챔버 내에 수납된 워크피스를 상기 투광성 윈도우를 통하여 조사하도록 구성된 레이저 발생 장치를 갖는 레이저 본딩 장치가 제공된다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER bonding apparatus method of bonding semiconductor device and method of fabricating semiconductor package |
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