LASER bonding apparatus method of bonding semiconductor device and method of fabricating semiconductor package

A laser bonding device is provided. The laser bonding device comprises a chamber having a light transmitting window and capable of receiving a workpiece; a gas supply line connected to the chamber and configured to supply gas at an elevated pressure relative to the outside of the chamber; and a lase...

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Bibliographische Detailangaben
Hauptverfasser:	LIM JUN SU, SATOSHI INADA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser bonding device is provided. The laser bonding device comprises a chamber having a light transmitting window and capable of receiving a workpiece; a gas supply line connected to the chamber and configured to supply gas at an elevated pressure relative to the outside of the chamber; and a laser generating device disposed outside the chamber and configured to irradiate a workpiece stored in the chamber through the light transmitting window. It is possible to fabricate semiconductor products at low costs. 투광성(transmissive) 윈도우를 갖고 워크피스(workpiece)를 수납할 수 있는 챔버; 상기 챔버에 연결되고, 챔버 외부에 비하여 상승된 압력으로 가스를 공급할 수 있도록 구성된 가스 공급 도관; 및 상기 챔버의 외부에 배치되며, 상기 챔버 내에 수납된 워크피스를 상기 투광성 윈도우를 통하여 조사하도록 구성된 레이저 발생 장치를 갖는 레이저 본딩 장치가 제공된다.