EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
The present invention relates to an epoxy resin composition for encapsulating a semiconductor device comprising an epoxy resin, a hardener, a hardening accelerator and an inorganic filler and to a semiconductor device encapsulated by using the same. The hardener comprises 0.1 to 5 wt% of a modified...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention relates to an epoxy resin composition for encapsulating a semiconductor device comprising an epoxy resin, a hardener, a hardening accelerator and an inorganic filler and to a semiconductor device encapsulated by using the same. The hardener comprises 0.1 to 5 wt% of a modified polyphenylene oxide resin in the epoxy resin composition for encapsulating a semiconductor device. According to the present invention, as thermal conductivity is increased and heat radiation of a semiconductor package is increased, malfunctions and defects of the semiconductor package can be inhibited.
에폭시 수지, 경화제, 경화 촉진제 및 무기 충전제를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물이고, 상기 경화제는 변성 폴리페닐렌 옥사이드 수지를 포함하고, 상기 변성 폴리페닐렌 옥사이드 수지는 상기 반도체 소자 밀봉용 에폭시 수지 조성물 중 0.1 중량% 내지 5 중량%로 포함되는 것인, 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용해 밀봉된 반도체 소자에 관한 것이다. |
---|