WELDING METHOD FOR CARBON FIBER REINFORCED PLASTICS SHEETS

Disclosed is a method for bonding composite panels. According to one embodiment of the present invention, the method for bonding composite panels forms a predetermined through-hole on one side of a composite panel to be bonded between upper and lower panels, and uses a tapping nut inserted into the...

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Bibliographische Detailangaben
Hauptverfasser:	BAE, MIN GWAN, PARK, SANG EON, YOO, KYUNG SUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Disclosed is a method for bonding composite panels. According to one embodiment of the present invention, the method for bonding composite panels forms a predetermined through-hole on one side of a composite panel to be bonded between upper and lower panels, and uses a tapping nut inserted into the through-hole to perform resistance welding on the upper and lower panels to secure a sufficient bonding force without cracking a bonding surface. The method comprises: a hole forming step of forming a predetermined through-hole on one side of the composite panel; a nut fixing step of inserting and fixing the tapping nut to the through-hole; an adhesive coating step of coating an adhesive between the through-hole and the tapping nut; a panel loading step of arranging the upper and lower panels on both surfaces of the composite panel; and a bonding step of supplying electricity through upper and lower pressing electrodes corresponding to the tapping nut while pressing the upper and lower panels to resistance-weld the tapping nut to the upper and lower panels. 복합판재의 접합방법이 개시된다. 본 발명의 일 실시 예에 따른 복합판재의 접합방법은 상판과 하판 사이에 접합할 복합판재의 일측에 일정한 관통홀을 형성하고 상기 관통홀에 끼워지는 태핑너트를 이용하여 상기 상판과 하판에 저항 용접하여 접합표면의 균열을 방지하면서도 체결력을 충분히 확보하도록, 복합판재의 일측에 일정한 관통홀을 형성하는 홀 성형단계; 상기 관통홀에 태핑너트를 끼워 넣어 고정하는 너트 고정단계; 상기 관통홀과 상기 태핑너트 사이에 접착제를 도포하는 접착제 도포단계; 상기 복합판재의 양쪽 면에 상판과 하판을 각각 배치하는 판재 로딩단계; 및 상기 태핑너트에 대응하여 상부 및 하부 가압전극을 통하여 상기 상판과 하판을 가압하면서 통전하여 상기 상판과 하판을 상기 태핑너트에 저항 용접하는 접합단계를 포함한다.