POWDER COMPOSITION FOR FORMING THICK FILM CONDUCTOR AND PASTE FOR FORMING THICK FILM CONDUCTOR

The present invention relates to a powder composition for forming a thick film conductor, which can form the thick film conductor which is easy to plate, and a paste for forming a thick film conductor. The powder composition for forming a thick film conductor comprises: conductive powder; lead-free...

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Bibliographische Detailangaben
1. Verfasser:	AWAGAKUBO SHINGO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CONDUCTORS ELECTRICITY GLASS INSULATORS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	The present invention relates to a powder composition for forming a thick film conductor, which can form the thick film conductor which is easy to plate, and a paste for forming a thick film conductor. The powder composition for forming a thick film conductor comprises: conductive powder; lead-free glass powder; and manganese oxide powder, wherein the content of the glass powder is 1.5 to 5 parts by mass with respect to 100 parts by mass of the conductive powder, and the content of the manganese oxide powder is 0.5 to 3.5 parts by mass with respect to 100 parts by mass of the conductive powder. (과제) 도금이 부착되기 쉬운 후막 도체를 형성할 수 있는, 후막 도체 형성용 분말 조성물 및 후막 도체 형성용 페이스트를 제공한다. (해결 수단) 도전 분말과, 납 프리 유리 분말과, 산화망간 분말을 포함하고, 상기 유리 분말의 함유량이, 상기 도전 분말 100 질량부에 대해, 1.5 질량부 이상 5 질량부 이하이고, 상기 산화망간 분말의 함유량이, 상기 도전 분말 100 질량부에 대해, 0.5 질량부 이상 3.5 질량부 이하인, 후막 도체 형성용 분말 조성물.