EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME

The present invention relates to: an epoxy resin composition for sealing a semiconductor device comprising an epoxy resin, a curing agent, a filler, and a curing accelerator, wherein the filler comprises a mixture of diamond nanoparticles and at least one of alumina, aluminum nitrate, and boron nitr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOON JI AH, KIM JUNG HWA, PARK YONG YEOP, BAE KYOUNG CHUL, KIM SANG KYUN, LEE DONG HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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