EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME

The present invention relates to: an epoxy resin composition for sealing a semiconductor device comprising an epoxy resin, a curing agent, a filler, and a curing accelerator, wherein the filler comprises a mixture of diamond nanoparticles and at least one of alumina, aluminum nitrate, and boron nitr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOON JI AH, KIM JUNG HWA, PARK YONG YEOP, BAE KYOUNG CHUL, KIM SANG KYUN, LEE DONG HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention relates to: an epoxy resin composition for sealing a semiconductor device comprising an epoxy resin, a curing agent, a filler, and a curing accelerator, wherein the filler comprises a mixture of diamond nanoparticles and at least one of alumina, aluminum nitrate, and boron nitrate, and the diamond nanoparticles have about 1 to 100 nm of an average particle diameter (D50); and the semiconductor device sealed by using the same. The present invention provides the epoxy resin composition for sealing the semiconductor device having an excellent heat radiation effect by having a high thermal conductivity. 에폭시 수지; 경화제; 충진제; 및 경화 촉진제를 포함하고, 상기 충진제는 알루미나, 알루미늄 니트레이트, 보론 니트레이트 중 하나 이상; 및 다이아몬드 나노입자의 혼합물을 포함하고, 상기 다이아몬드 나노입자는 평균입경(D50)이 1nm 내지 100nm인 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용해 밀봉된 반도체 장치에 관한 것이다.