A POLISHING PAD HAVING INTERNAL CHANNEL AND A METHOD OF PREPARING THE SAME

Provided are a polishing pad including an internal channel and a manufacturing method thereof. The internal channel penetrates the polishing pad, and an opening part of the internal channel is located on a polishing surface of the polishing pad. Therefore, the present invention is capable of reducin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE TAE WOO, KIM PAL KON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are a polishing pad including an internal channel and a manufacturing method thereof. The internal channel penetrates the polishing pad, and an opening part of the internal channel is located on a polishing surface of the polishing pad. Therefore, the present invention is capable of reducing the amount of polishing liquid such as slurry wasted during a polishing process. 내부 채널을 포함하는, 연마 패드로서, 상기 내부 채널은 상기 연마 패드를 관통하는 것이고, 상기 내부 채널의 개구부는 상기 연마 패드의 연마 면에 위치되는 것인, 연마 패드, 및 이의 제조 방법을 제공한다.