Electronic device

The present invention relates to an electronic device which comprises: a board including a plating pattern; a first terminal being in contact with the plating pattern to be arranged by protruding from the board; a second terminal electrically connected to a wire; and a cover coupled to the second te...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOON YOUNG HOON, PARK JONG SUN, KANG WOO SEOK, JEONG SOO YOUNG, CHOI SANG SU, WON JUNG MO, LEE WON YOUNG, RYU SEUNG NAM, SONG IL HWAN, KIM YOON HOE
Format: Patent
Sprache:eng ; kor
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention relates to an electronic device which comprises: a board including a plating pattern; a first terminal being in contact with the plating pattern to be arranged by protruding from the board; a second terminal electrically connected to a wire; and a cover coupled to the second terminal. The second terminal includes; a connection unit connected to the wire; and a boss unit protruding from the connection unit to coupled to the first terminal, and coupling to the cover. By excluding soldering, a space limit for connecting the wire and the board is reduced. 본 발명은, 도금패턴을 포함하는 기판; 상기 도금패턴과 접촉하여 상기 기판에 돌출되어 배치되는 제1 단자; 와이어와 전기적으로 연결되는 제2 단자;및 상기 제2 단자와 결합하는 커버를 포함하고, 상기 제2 단자는 상기 와이어와 연결되는 연결부와, 상기 연결부에서 돌출되어 상기 제1 단자와 결합하는 보스부를 포함하고, 상기 커버는 상기 보스부에 결합하는 전자 장치를 제공하여, 납땜을 배제하여, 와이어와 기판을 연결하는데 있어서 공간적 제약을 줄이는 유리한 효과를 제공한다.