POLYETHYLENE RESIN COMPOSITION AND FILM COMPRISING THE SAME

A polyethylene resin composition for a film of the present invention comprises, based on 100 parts by weight of a basic resin comprising (A) 80 to 90 wt% of a high-density polyethylene polymer having 0.03 to 0.100 g/10min of a melt index (190°C, 2.16kg) and 0.950 to 0.960 g/cm^3 of a density, and (B...

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Bibliographische Detailangaben
Hauptverfasser:	KO HWAN HO, YOU JAE MYOUNG, CHA SANG HUN, YOON CHAN SEOG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A polyethylene resin composition for a film of the present invention comprises, based on 100 parts by weight of a basic resin comprising (A) 80 to 90 wt% of a high-density polyethylene polymer having 0.03 to 0.100 g/10min of a melt index (190°C, 2.16kg) and 0.950 to 0.960 g/cm^3 of a density, and (B) 10 to 20 wt% of a low-density polyethylene polymer having 1.0 to 5.0 g/10min of the melt index (190°C, 2.16kg) and 0.910 to 0.930 g/cm^3 of the density, (C) 0.7 to 2 parts by weight of a benzotriazole-based compound. The present invention has excellent transparency, tensile strength, tearing strength, and elongation. 본 발명의 필름용 폴리에틸렌 수지 조성물은 (A) 용융지수(190℃, 2.16kg)가 0.03~0.100 g/10min 이고, 밀도가 0.950~0.960 g/cm인 고밀도 폴리에틸렌 중합체 80 내지 90 중량%; 및 (B) 용융지수(190℃, 2.16kg)가 1.0~5.0 g/10min 이고, 밀도가 0.910~0.930 g/cm인 저밀도 폴리에틸렌 중합체 10 내지 20 중량%을 포함하는 기초수지 100 중량부에 대하여, (C)벤조트리아졸계 화합물 0.7 내지 2 중량부을 포함한다.