능동 전자 주사 배열(AESA)을 위한 타일

일 양태에서, 능동 전자 주사 배열(AESA) 타일은 방열기 구조물 및 방열기 구조물에 부착되고 무선 주파수(RF) 매니폴드 및 빔 형성기를 포함하는 산화물 결합 반도체 웨이퍼를 포함한다. 산화물 결합 웨이퍼를 통한 RF 신호 경로는 빔 형성기를 향해 전파하는 제1 부분 및 빔 형성기에 평행하게 전파하는 제2 부분을 포함한다. In one aspect, an active electronically scanned array (AESA) tile includes a radiator structure and oxide-bonded sem...

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Hauptverfasser:	MILNE JASON G, DRAB JOHN J, ROLSTON KEVIN C, TESHIBA MARY A
Format:	Patent
Sprache:	kor
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	MILNE JASON G DRAB JOHN J ROLSTON KEVIN C TESHIBA MARY A
description	일 양태에서, 능동 전자 주사 배열(AESA) 타일은 방열기 구조물 및 방열기 구조물에 부착되고 무선 주파수(RF) 매니폴드 및 빔 형성기를 포함하는 산화물 결합 반도체 웨이퍼를 포함한다. 산화물 결합 웨이퍼를 통한 RF 신호 경로는 빔 형성기를 향해 전파하는 제1 부분 및 빔 형성기에 평행하게 전파하는 제2 부분을 포함한다. In one aspect, an active electronically scanned array (AESA) tile includes a radiator structure and oxide-bonded semiconductor wafers attached to the radiator structure and comprising a radio frequency (RF) manifold and a beam former. An RF signal path through the oxide-bonded wafers comprises a first portion that propagates toward the beam former and a second portion that propagates parallel to the beam former.
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In one aspect, an active electronically scanned array (AESA) tile includes a radiator structure and oxide-bonded semiconductor wafers attached to the radiator structure and comprising a radio frequency (RF) manifold and a beam former. 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In one aspect, an active electronically scanned array (AESA) tile includes a radiator structure and oxide-bonded semiconductor wafers attached to the radiator structure and comprising a radio frequency (RF) manifold and a beam former. An RF signal path through the oxide-bonded wafers comprises a first portion that propagates toward the beam former and a second portion that propagates parallel to the beam former.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB63bX0df9MhTcLWt7Mm6DwZvGeN01rFF5v2PBm-hYNR9dgR803c1sU3sxpeTt1jsLb5oY3c_fwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yAjA0NLAwMTU0sTQ0dj4lQBAHrrN7A</recordid><startdate>20190503</startdate><enddate>20190503</enddate><creator>MILNE JASON G</creator><creator>DRAB JOHN J</creator><creator>ROLSTON KEVIN C</creator><creator>TESHIBA MARY A</creator><scope>EVB</scope></search><sort><creationdate>20190503</creationdate><title>능동 전자 주사 배열(AESA)을 위한 타일</title><author>MILNE JASON G ; DRAB JOHN J ; ROLSTON KEVIN C ; TESHIBA MARY A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190045941A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2019</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MILNE JASON G</creatorcontrib><creatorcontrib>DRAB JOHN J</creatorcontrib><creatorcontrib>ROLSTON KEVIN C</creatorcontrib><creatorcontrib>TESHIBA MARY A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MILNE JASON G</au><au>DRAB JOHN J</au><au>ROLSTON KEVIN C</au><au>TESHIBA MARY A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>능동 전자 주사 배열(AESA)을 위한 타일</title><date>2019-05-03</date><risdate>2019</risdate><abstract>일 양태에서, 능동 전자 주사 배열(AESA) 타일은 방열기 구조물 및 방열기 구조물에 부착되고 무선 주파수(RF) 매니폴드 및 빔 형성기를 포함하는 산화물 결합 반도체 웨이퍼를 포함한다. 산화물 결합 웨이퍼를 통한 RF 신호 경로는 빔 형성기를 향해 전파하는 제1 부분 및 빔 형성기에 평행하게 전파하는 제2 부분을 포함한다. In one aspect, an active electronically scanned array (AESA) tile includes a radiator structure and oxide-bonded semiconductor wafers attached to the radiator structure and comprising a radio frequency (RF) manifold and a beam former. An RF signal path through the oxide-bonded wafers comprises a first portion that propagates toward the beam former and a second portion that propagates parallel to the beam former.</abstract><oa>free_for_read</oa></addata></record>
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title	능동 전자 주사 배열(AESA)을 위한 타일
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