PHOTO CURABLE AND THERMO CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

The present invention relates to: a photocurable and thermosetting resin composition comprising an epoxy resin, a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein the value of the equivalent number of an epoxy group/the equivalent number of a car...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE HWAYOUNG, YUN GEUMHEE, CHONG SEOLAH
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to: a photocurable and thermosetting resin composition comprising an epoxy resin, a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein the value of the equivalent number of an epoxy group/the equivalent number of a carboxyl group is more than 1 and less than 2; and a cured product thereof. According to the present invention, it is possible to minimize problems such as a residue of a via hole bottom, a taper of the via hole and the like, and to form the cured product having excellent thermal characteristics. 본 발명은 에폭시 수지; 카르복실기 함유 감광성 수지; 광중합 개시제; 및 충전제를 포함하고, 에폭시기의 당량수/카르복실기의 당량수의 값이 1 초과 2 미만인, 광경화성 및 열경화성 수지 조성물, 및 그 경화물에 관한 것이다. 본 발명에 의하면, 비아홀 바닥부의 잔사, 비아홀의 테이퍼(taper) 등의 문제를 최소화하고, 우수한 열특성을 가지는 경화물을 형성할 수 있다.