Method for inspecting a semiconductor substrate and method for manufacturing a semiconductor device
A method for inspecting a semiconductor substrate according to some embodiments comprises: a step of measuring the amount of light reflected on a rotating semiconductor substrate; a step of analyzing a frequency distribution of the measured amount of light; and a step of determining the state of the...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | A method for inspecting a semiconductor substrate according to some embodiments comprises: a step of measuring the amount of light reflected on a rotating semiconductor substrate; a step of analyzing a frequency distribution of the measured amount of light; and a step of determining the state of the semiconductor substrate using the frequency distribution. The step of analyzing the frequency distribution of the measured amount of light includes a process of extracting a plurality of frequency components corresponding to a plurality of frequencies, respectively.
일부 실시예들에 따른 반도체 기판을 검사하는 방법은 회전하는 반도체 기판에 반사된 광량을 측정하는 단계, 측정된 상기 광량의 주파수 분포를 분석하는 단계, 및 상기 주파수 분포를 이용하여 상기 반도체 기판의 상태를 결정하는 단계를 포함하고, 상기 측정된 상기 광량의 주파수 분포를 분석하는 단계는 복수개의 주파수에 각각 대응하는 복수개의 주파수 성분들을 추출하는 것을 포함한다. |
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