ADHESIVE COMPOSITION AND STAMPING FOIL INCLUDIG THE SAME

The present invention relates to an adhesive composition, and stamping foil comprising the same which has excellent blocking resistance and excellent cuttability. The adhesive composition comprises: a (meth)acrylate-based polymer; a vinyl chloride-based polymer; a rosin-based compound; and inorganic...

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Bibliographische Detailangaben
Hauptverfasser:	MIN CHANG JO, SEUNG HUN LEE, GEO HYEOK LIM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesive composition, and stamping foil comprising the same which has excellent blocking resistance and excellent cuttability. The adhesive composition comprises: a (meth)acrylate-based polymer; a vinyl chloride-based polymer; a rosin-based compound; and inorganic particles having a specific surface area of 100 to 300 m^2/g. 발명은 접착제 조성물 및 이를 포함하는 스탬핑 호일에 관한 것이다. 상기 접착제 조성물은, (메트)아크릴레이트계 중합체, 염화비닐계 중합체, 로진계 화합물, 및 비표면적이 100 m/g 내지 300 m/g 인 무기입자들을 포함한다.