DICINGDIE BONDING SHEET

Provided is a dicing and die bonding sheet having an adhesive layer capable of suppressing shrinkage of an adhesive layer caused by deformation of a substrate during a dicing process. According to the dicing and die bonding sheet, in which the adhesive layer is laminated on the substrate, of the pre...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NEZU YUSUKE, KARASAWA YASUNORI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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