POLYIMIDE BASED ADHESIVE COMPOSITION BONDING SHEET COMPRISING THE SAME AND METHOD FOR MANUFACTURING BONDING SHEET USING THE SAME

Provided is a polyimide-based adhesive composition comprising a polyimide-based resin and an inorganic filler. By comprising the polyimide-based adhesive composition, it is possible to manufacture the polyimide-based adhesive composition having high insulation resistance and low dielectric propertie...

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Bibliographische Detailangaben
Hauptverfasser:	NOH, SEUNG HUN, JEON, SEUNG HWAN, NA, HYEONG KYUN, HEO, KYUN, DOH, SANG GIL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is a polyimide-based adhesive composition comprising a polyimide-based resin and an inorganic filler. By comprising the polyimide-based adhesive composition, it is possible to manufacture the polyimide-based adhesive composition having high insulation resistance and low dielectric properties, and a bonding sheet comprising the same. 폴리이미드계 수지 및 무기 충진제를 포함하는 폴리이미드계 접착제 조성물이 제공된다. 상기 폴리이미드계 접착제 조성물을 포함함으로써, 절연 저항이 높고, 저유전 특성을 가지는 폴리이미드계 접착제 조성물 및 이를 포함하는 본딩 시트을 제조할 수 있다.