SIDE-SOLDERABLE LEADLESS PACKAGE

A lead frame is formed by chemically half-etching a sheet of a conductive material. The half-etching exposes a first side of a first contact part of the lead frame. A solder-soluble layer is plated on the first side of the first contact part. A sealing material is deposited on the lead frame after p...

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Bibliographische Detailangaben
1. Verfasser:	BATHAN HENRY DESCALZO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A lead frame is formed by chemically half-etching a sheet of a conductive material. The half-etching exposes a first side of a first contact part of the lead frame. A solder-soluble layer is plated on the first side of the first contact part. A sealing material is deposited on the lead frame after plating the solder-soluble layer. 리드 프레임은 전도성 재료의 시트를 화학적으로 하프 에칭함으로써 형성된다. 하프-에칭은 리드 프레임의 제 1 접촉부의 제 1 측면을 노출시킨다. 솔더 가용성 층은 제 1 접촉부의 제 1 측면 상에 도금된다. 밀봉재는 솔더 가용성 층을 도금 한 후에 리드 프레임 상에 증착된다.