SEMICONDUCTIVE COMPOSITION FOR CABLE
The present invention relates to a semiconductive resin composition having excellent peeling properties, which can be used for both an inner semiconductive layer and an outer semiconductive layer of a power cable and which can be used particularly for an outer semiconductive layer. The present inven...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a semiconductive resin composition having excellent peeling properties, which can be used for both an inner semiconductive layer and an outer semiconductive layer of a power cable and which can be used particularly for an outer semiconductive layer. The present invention also relates to a novel semiconductive resin composition having improved heat resistance and mechanical properties and reduced deterioration properties. Based on 100 parts by weight of a composite resin comprising a polypropylene homopolymer and an ethylene-(meth)acrylate resin having a melting point of 150-170°C, 20-70 parts by weight of one or more conductive particles selected from carbon black, graphite, and graphene are included.
본 발명은 전력용 케이블의 내부반도전층이나 외부반도전층에 모두 사용할 수 있으며, 특히 외부반도전층에 사용할 수 있는 박리성이 우수한 반도전층 수지 조성물에 관한 것이다. 또한 본 발명은 내열성과 기계적 물성이 개선되고 열화성을 개선한 새로운 반도전성 수지 조성물에 관한 것이다. |
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