POLISHING PAD COMPRISING WINDOW HAVING SIMILAR HARDNESS WITH POLISHING LAYER

An embodiment relates to a polishing pad including a window having hardness similar to that of a polishing layer, in which the polishing pad includes a window having hardness similar to that of the polishing layer and a polishing speed, and prevents surface defects such as scratches of a wafer gener...

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Bibliographische Detailangaben
Hauptverfasser:	SEO, JANG WON, YUN, SUNG HOON, AHN, JAE IN, RYOU, JOON SUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	An embodiment relates to a polishing pad including a window having hardness similar to that of a polishing layer, in which the polishing pad includes a window having hardness similar to that of the polishing layer and a polishing speed, and prevents surface defects such as scratches of a wafer generated during a CMP process. Additionally, the polishing layer and the window of the polishing pad are similar in hardness change rate depending on a temperature such that similar hardness can be maintained even by a changed temperature during the CMP process. 실시예는 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드에 관한 것으로서, 상기 연마패드는 연마층과 유사한 경도 및 연마 속도를 갖는 윈도우를 포함하여 CMP 공정 중 발생하는 웨이퍼의 스크래치 등의 표면 결함을 방지하는 효과가 있다. 또한, 상기 연마패드의 연마층과 윈도우는 온도에 따른 경도 변화율이 유사하여, CMP 공정 중 변화되는 온도에 의해서도 유사한 경도를 유지할 수 있다.