PRINTED CIRCUIT BOARD HAVING EMI SHIELDING FUNCTION AND METHOD FOR MANUFACTURING OF THE SAME AND FLAT CABLE USING THE SAME
Disclosed is a printed circuit board having an electromagnetic interference (EMI) shielding function to enable high-speed transmission by emitting electromagnetic waves and noise from a signal portion through a shield layer and a ground contact portion. The printed circuit board having EMI shielding...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | Disclosed is a printed circuit board having an electromagnetic interference (EMI) shielding function to enable high-speed transmission by emitting electromagnetic waves and noise from a signal portion through a shield layer and a ground contact portion. The printed circuit board having EMI shielding function comprises: a base material; the signal portion which is arranged on the base material; the ground contact portion which is arranged alongside the signal portion; an insulation layer which is arranged on an upper part of the base material and covers the signal portion and the ground contact portion; an EMI shielding layer which is arranged on an upper part of the insulation layer and a lower part of the base material; and a shielding bridge which electrically connects the EMI shielding layer on the upper part of the insulation layer and the EMI shielding layer on the lower part of the base material by penetrating the base material and the insulation layer, on both ends of the signal portion.
본 발명은 전자파 차폐 기능을 갖는 회로기판에 관한 것으로서, 본 발명에 따른 전자파 차폐 기능을 갖는 회로기판은 기재;와, 상기 기재 상에 배치되는 신호부;와, 상기 신호부와 나란하게 배치되는 접지부;와, 상기 기재의 상부에 배치되어 상기 신호부와 상기 접지부를 커버하는 절연층;과, 상기 절연층의 상부와 상기 기재의 하부에 각각 배치되는 전자파 차폐층; 및 상기 신호부의 양측에서 상기 기재와 상기 절연층을 관통하여 상기 절연층 상부의 전자파 차폐층과 상기 기재 하부의 전자파 차폐층을 전기적으로 연결하는 차폐브릿지;를 포함하는 것을 특징으로 한다. |
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