SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
The present disclosure relates to a semiconductor light emitting device. The semiconductor light emitting device comprises: a body part having a concave upper surface in a central region; a bottom part which is arranged with a semiconductor light emitting device chip and has a part corresponding to...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present disclosure relates to a semiconductor light emitting device. The semiconductor light emitting device comprises: a body part having a concave upper surface in a central region; a bottom part which is arranged with a semiconductor light emitting device chip and has a part corresponding to the central region protruding from the bottom surface of the body part; and a plurality of support parts located on the lower surface of the body part and not overlapping the bottom part. The support part includes a metal bonding part. It is possible to improve light extraction efficiency.
본 개시는 반도체 발광소자에 있어서, 중앙영역이 오목한 상면을 갖는 본체부; 반도체 발광소자 칩이 배치되며 중앙영역에 대응되는 부분이 본체부의 하면으로 돌출된 바닥부; 그리고 본체부의 하면에 위치하며 바닥부와 중첩되지 않는 복수의 지지부;를 포함하고, 지지부는 금속 접합부를 포함하는 반도체 발광소자에 관한 것이다. |
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