두 기판을 결합하기 위한 방법 및 장치
본 발명은 2개의 기판을 결합하기 위한 방법 및 장치에 관한 것이다. A method and device for temporarily bonding a product substrate to a carrier substrate. The method includes a) applying a bonding adhesive to the product substrate and/or the carrier substrate to form a bonding adhesive layer having first and second areas; b) c...
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| Format: | Patent |
| Sprache: | kor |
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| Zusammenfassung: | 본 발명은 2개의 기판을 결합하기 위한 방법 및 장치에 관한 것이다.
A method and device for temporarily bonding a product substrate to a carrier substrate. The method includes a) applying a bonding adhesive to the product substrate and/or the carrier substrate to form a bonding adhesive layer having first and second areas; b) connecting the carrier substrate to the product substrate via the bonding adhesive layer; and c) after step b), hardening only the first area of the bonding adhesive layer, wherein the second area of the bonding adhesive layer is not hardened or at least is not substantially hardened. |
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