WAFER PROCESSING METHOD

An objective of the present invention is to allow a wafer to be easily transferred from a protective tape to another adhesive tape. A protective tape (T) is attached to a surface (Wa) of a wafer (W) and the wafer is rotated while a cutting blade (12) is inserted into an outer peripheral edge of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAYA YURIKA, ERITATE MANA, KOSHIMIZU HIDEKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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