ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING METHOD THEREOFTHE SAME

The present invention provides an acoustic wave device capable of increasing airtightness of a resonance part and a manufacturing method thereof. According to an embodiment of the present invention, the acoustic wave device comprises: a substrate having one surface provided with an acoustic wave gen...

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Bibliographische Detailangaben
Hauptverfasser:	BAEK, HYUNG GOO, LEE, YEONG GYU, YANG, JEONG SUONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
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Beschreibung
Zusammenfassung:	The present invention provides an acoustic wave device capable of increasing airtightness of a resonance part and a manufacturing method thereof. According to an embodiment of the present invention, the acoustic wave device comprises: a substrate having one surface provided with an acoustic wave generating part; a support part separated from the acoustic wave generating part on one surface of the substrate; a protective member coupled to the support part and separated from the acoustic wave generating part at a predetermined interval; and a sealing part sealing the protective member and the support part. The sealing part includes at least one first airtight layer and at least one second airtight layer. The first airtight layer and the second airtight layer are alternatively laminated. 본 발명의 실시예에 따른 음향파 디바이스는 일면에 음향파 발생부가 구비된 기판, 상기 기판의 일면에 상기 음향파 발생부와 이격되게 구비되는 지지부, 상기 지지부에 결합되며 상기 음향파 발생부와 소정간격 이격 배치되는 보호 부재, 및 상기 보호 부재와 상기 지지부를 밀봉하는 실링부를 포함하며, 상기 실링부는 적어도 하나의 제1 기밀층과 적어도 하나의 제2 기밀층을 포함하고, 상기 제1 기밀층과 상기 제2 기밀층은 교대로 적층된다.