Polypropylene Complex Resin Composition for Low Temperature Injection-Molding

The present invention relates to a polypropylene complex resin composition which has the melt flow index (MI), measured in the condition at 200°C and with 2.16 kg load, of 20 to 30 g/10 min; and the spiral flow value at 200°C injection of 500 to 800 mm. The polypropylene complex resin composition co...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, BEOM HO, KIM, YONG HO, LEE, HAN KI, KIM, DAE SIK, LEE, HYEOK, CHOI, HOI JIN, PARK, JU SEONG, KIM, HAK SOO, BAK, MUN GYU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a polypropylene complex resin composition which has the melt flow index (MI), measured in the condition at 200°C and with 2.16 kg load, of 20 to 30 g/10 min; and the spiral flow value at 200°C injection of 500 to 800 mm. The polypropylene complex resin composition contains a polypropylene resin, an olefin-based elastomer, an inorganic reinforcing agent, and an additive. An objective of the present invention to provide a novel polypropylene complex resin composition which is capable of injection-molding under a low temperature condition in which a soft skin is not deteriorated. 본 발명은 200℃ 및 2.16 ㎏ 하중 조건에서 측정한 용융흐름지수(MI) 값이 20 ~ 30 g/10min이고, 200℃ 사출기준으로 스파이럴 플로우(spiral flow) 값이 500 ~ 800 ㎜인 저온사출 성형용 폴리프로필렌 복합수지 조성물에 관한 것이다.