LED MODULE TYPE HEAT SINK INSERT STRUCTURE

The present invention relates to a press-fit structure of a heat sink for an LED module capable of improving dustproof and waterproof functions, which fixes pam nuts and heat dissipating rods to a heat dissipating plate by press fitting, and subjects each of the pam nuts and the heat dissipating rod...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHOI, JEONG GYU, KIM, GUN YOUNG, KIM, KWON JIN, KWON, WOO SUB
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a press-fit structure of a heat sink for an LED module capable of improving dustproof and waterproof functions, which fixes pam nuts and heat dissipating rods to a heat dissipating plate by press fitting, and subjects each of the pam nuts and the heat dissipating rods to press fitting and waterproofing treatments through first and second O-rings, thereby improving durability and dustproof and waterproof functions for the LED module. To this end, the present invention includes an LED module consisting of a heat sink (10) and an LED lamp (20) provided on the heat sink (10) to emit light. A pem nut (130) is fixed to the heat sink (10) through the press fitting for waterproofing performance and supports the LED lamp (20) so that an electric wire can be connected to the LED lamp (20). The pem nut (130) includes: a head part (132); an insertion part (134) extending from the head part (132); and a mounting part (136) formed between the head part (132) and the insertion part (134) and having a predetermined depth. When the head part (132) of the pem nut (130) is press-fitted through an insertion hole (114) formed on the heat dissipating plate (110) of the heat sink (10), a part of the heat dissipating plate (110) is filled with a space of a pressing part (136) by volume deformation of the heat dissipating plate (110) such that the heat dissipating plate (110) is subjected to a fixing force and the waterproofing treatment of the pem nut (130). 본 발명은, 방진 및 방수기능을 향상시키는 엘이디 모듈용 방열판의 압입구조에 관한 것으로서, 방열플레이트에 팸너트 및 방열봉을 압입방식으로 고정하고, 또한 상기 팸너트 및 방열봉 각각에 제1 및 제2오링을 통해 압입과 함께 방수처리가 이루어지도록 함으로써, 엘이디 모듈에 대한 내구성과 방진 및 방수기능을 향상시키는 데 그 목적이 있다. 이를 위해 본 발명은, 방열판(10)과, 상기 방열판(10) 상에 구성되어 조명하는 엘이디 램프(20)로 구성되는 엘이디 모듈을 포함하고; 상기 방열판(10)에는 상기 엘이디 램프(20)에 전선이 연결되도록 지지하고, 방수성능이 발휘되도록 압입방식으로 고정되는 팸너트(130)를 포함하며; 상기 팸너트(130)는 머리부(132)와, 상기 머리부(132)에서 연장되는 삽입부(134), 및 상기 머리부(132)와 삽입부(134) 사이에 구성되고 일정깊이 형성되는 안착부(136)로 구성되어, 상기 팸너트(130)의 머리부(132)가 방열판(10)의 방열플레이트(110)에 형성된 삽입공(114)을 통해 압입될 때 상기 방열플레이트(110)의 체적변형에 의해 상기 방열플레이트(110)의 일부가 상기 압착부(136)의 공간으로 채워져 상기 방열플레이트(110)에 대하여 팸너트(130)의 고정력 및 방수처리가 되도록 하는 것을 특징으로 한다.