SOLDER COMPOSITION FOR PRECOATING AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

According to the present invention, a solder composition for precoating contains: a rosin-based resin (A); an activator (B); a flux composition containing a solvent (C); and soldering powder (D). The component (B) contains N,N,N′,N′-tetrakis-(2-hydroxypropyl)-ethylenediamine (B1), and a particle hav...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBASAKI MASANORI, KIMURA HITOMI, IIJIMA NORISHIGE, HARA TAKUMI, SAKAI YUUKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	According to the present invention, a solder composition for precoating contains: a rosin-based resin (A); an activator (B); a flux composition containing a solvent (C); and soldering powder (D). The component (B) contains N,N,N′,N′-tetrakis-(2-hydroxypropyl)-ethylenediamine (B1), and a particle having a diameter less than 5 μm occupies at least 40 vol.% among the component (D). 본 발명의 프리코팅용 땜납 조성물은 (A) 로진계 수지와, (B) 활성제와, (C) 용제를 함유하는 플럭스 조성물과, (D) 땜납 분말을 함유하고, 상기 (B) 성분이 (B1) N,N,N',N'-테트라키스(2-히드록시프로필)에틸렌디아민을 함유하고, 상기 (D) 성분 중 입자지름이 5㎛ 이하인 입자가 40체적% 이상인 것을 특징으로 하는 것이다.