PHOTOSENSITIVE COMPOSITIONS

The present invention relates to a photosensitive composition which comprises: polyester amide acid (A), a compound (B) having a polymerizable double bond, a photopolymerization initiators (C), a polymer (D) having an epoxy group with weight average molecular weight of 3,000 to 50,000, an epoxy comp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OKAMOTO YUKI, NARA KAZUMI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive composition which comprises: polyester amide acid (A), a compound (B) having a polymerizable double bond, a photopolymerization initiators (C), a polymer (D) having an epoxy group with weight average molecular weight of 3,000 to 50,000, an epoxy compound (E) containing 2-10 epoxy groups per molecule and having weight average molecular weight of less than 3,000, an epoxy curing agent (F), and a molecular weight modifier (G). The photosensitive composition of the present invention does not require an organic solvent having high polarity, and it is possible to form a cured film which is excellent in transparency, heat resistance, chemical resistance, flatness, resolution, and chemical resistance and is suitably used for electronic parts. 본 발명은 폴리에스테르아미드산(A), 중합성 이중 결합을 갖는 화합물(B), 광중합 개시제(C), 중량 평균 분자량이 3,000∼50,000인 에폭시기를 갖는 중합체(D), 에폭시기를 1분자당 2∼10개 포함하고, 중량 평균 분자량이 3,000 미만인 에폭시 화합물(E), 에폭시 경화제(F), 및 분자량 조정제(G)를 포함하는 감광성 조성물에 관한 것이다. 본 발명의 감광성 조성물은 극성이 높은 유기용제를 필요로 하지 않으며, 투명성, 내열성, 내약품성, 평탄성, 해상성, 및 내약품성이 우수한, 전자 부품에 적합하게 사용되는 경화막을 형성할 수 있다.