Electronic Component and System in Package

One of the objectives of the present invention is to improve rigidity characteristics of an electronic component to reduce delamination or crack. According to one embodiment of the present invention, an electronic component includes: an electrically insulating body; an external electrode disposed ou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOON, NAM SOON, JI, SOO YOUNG, CHOI, DAE CHUL, YANG, JEONG SUONG, YOO, HWAN SOO, KIM, TAE HO
Format: Patent
Sprache:eng ; kor
Schlagworte:
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