Electronic Component and System in Package

One of the objectives of the present invention is to improve rigidity characteristics of an electronic component to reduce delamination or crack. According to one embodiment of the present invention, an electronic component includes: an electrically insulating body; an external electrode disposed ou...

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Bibliographische Detailangaben
Hauptverfasser:	MOON, NAM SOON, JI, SOO YOUNG, CHOI, DAE CHUL, YANG, JEONG SUONG, YOO, HWAN SOO, KIM, TAE HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
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Beschreibung
Zusammenfassung:	One of the objectives of the present invention is to improve rigidity characteristics of an electronic component to reduce delamination or crack. According to one embodiment of the present invention, an electronic component includes: an electrically insulating body; an external electrode disposed outside the body; and a reinforcing unit disposed on a surface of the body and including a metal oxide layer and a graphene oxide layer. 본 발명의 일 실시 형태에 따른 전자 부품은 전기 절연성의 바디와, 상기 바디의 외부에 배치된 외부 전극 및 상기 바디의 표면에 배치되며, 금속 산화물층 및 그래핀 산화물층을 포함하는 보강부를 포함한다.