COMPRESSION MOLDING SYSTEM AND MOLDIUNG METHOD OF THE SAME

The present invention relates to a compression molding system comprising an upper mold and a lower mold, and more particularly, to a compression molding system capable of precisely adjusting cavity depth of the lower mold without replacing an extra mold even when a type of a semiconductor material t...

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Bibliographische Detailangaben
1. Verfasser:	OH, SOO HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a compression molding system comprising an upper mold and a lower mold, and more particularly, to a compression molding system capable of precisely adjusting cavity depth of the lower mold without replacing an extra mold even when a type of a semiconductor material to be molded and a size and a type of a molding powder are changed. 본 발명은 상부 금형과 하부 금형으로 구성되는 압축 몰딩 시스템에 있어서, 몰딩 대상 반도체 자재의 종류, 몰딩 파우더의 입자크기나 종류가 변경되는 경우에도, 별도의 금형 교체작업을 하지 않더라도 하부 금형의 캐비티 깊이의 정밀한 조절이 가능한 압축 몰딩 시스템에 관한 것이다.