SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
The present invention relates to a capacitor having improved capacitance, low leakage current, and excellent reliability, and a manufacturing method thereof. According to the present invention, a manufacturing method of a semiconductor device includes the steps of: forming a lower electrode having a...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention relates to a capacitor having improved capacitance, low leakage current, and excellent reliability, and a manufacturing method thereof. According to the present invention, a manufacturing method of a semiconductor device includes the steps of: forming a lower electrode having a high aspect ratio; forming an interface layer by sequentially performing a low-pressure first plasma process and a high-pressure second plasma process on the surface of the lower electrode; forming a dielectric layer on the interface layer; and forming an upper electrode on the dielectric layer.
본 기술은 캐패시턴스 향상, 낮은 누설 전류, 우수한 신뢰성의 캐패시터 및 그 제조 방법에 관한 것으로, 본 기술에 따른 반도체장치 제조 방법은 고종횡비의 하부전극을 형성하는 단계; 상기 하부전극의 표면에 대해 저압의 제1플라즈마처리 및 고압의 제2플라즈마처리를 순차적으로 진행하여 계면층을 형성하는 단계; 상기 계면층 상에 유전층을 형성하는 단계; 및 상기 유전층 상에 상부전극을 형성하는 단계를 포함할 수 있다. |
---|