AMBIENT CONTROLLED TRANSFER MODULE AND PROCESS SYSTEM

According to the present invention, provided are a method and an apparatus for processing a substrate. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ASSAF SHAY, NEWMAN JACOB, HICKERSON STEPHEN, CARLSON CHARLES, CONSTANT ANDREW, WEAVER WILLIAM TYLER
Format: Patent
Sprache:eng ; kor
Schlagworte:
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