SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
A semiconductor package including EMI shielding and a manufacturing method thereof are disclosed. In an embodiment, the method for manufacturing a semiconductor package includes the steps of forming a substrate; attaching a semiconductor device to the upper area of the substrate; encapsulating the s...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A semiconductor package including EMI shielding and a manufacturing method thereof are disclosed. In an embodiment, the method for manufacturing a semiconductor package includes the steps of forming a substrate; attaching a semiconductor device to the upper area of the substrate; encapsulating the semiconductor device using an encapsulant; forming a trench in the encapsulant; and forming a shielding layer on the surface of the encapsulant. Accordingly, the present invention can prevent electromagnetic waves generated from at least one of the semiconductor devices in the encapsulant from being emitted to the outside.
EMI 쉴딩을 포함하는 반도체 패키지와 그 제조 방법이 개시된다. 일 실시예에서, 반도체 패키지의 제조 방법은 서브스트레이트를 형성하고, 서브스트레이트의 상부 영역에 반도체 디바이스를 부착하고, 인캡슐런트를 이용하여 반도체 디바이스를 인캡슐레이트하고, 인캡슐런트 내에서 트렌치를 형성하고, 상기 인캡슐런트의 표면 상에 쉴딩층을 형성하는 것을 포함한다. |
|---|