SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

An object of the present invention is to provide a semiconductor manufacturing device capable of reducing stress applied to a die. The semiconductor manufacturing device includes a push-up unit, a collet and a control unit for controlling operation of the push-up unit and the collet. The push-up uni...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKUI YUKI, YOKOMORI TSUYOSHI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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