ENGINEERED STONE AND MANUFACTURING METHOD THEREOF
The present invention relates to engineered stone and a preparation method thereof, which comprises an optically transparent base material (I) and phosphorescent chips (II), wherein the optically transparent base material (I) includes 7 to 10 wt% of unsaturated polyester resin (A) and 90 to 93 wt% o...
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Zusammenfassung: | The present invention relates to engineered stone and a preparation method thereof, which comprises an optically transparent base material (I) and phosphorescent chips (II), wherein the optically transparent base material (I) includes 7 to 10 wt% of unsaturated polyester resin (A) and 90 to 93 wt% of a silica-containing compound (B) based on total weight of the optically transparent base material (I); the optically transparent base material (I) further includes 0.01 to 0.05 part by weight of an organic/inorganic pigment (C), based on 100 parts by weight of the unsaturated polyester resin (A); the phosphorescent chips (II) includes 9 to 12 wt% of unsaturated polyester resin (A), 88 to 91 wt% of the silica-containing compound (B′), and a phosphorescent pigment (D), based on total weight of the phosphorescent chips (II), wherein 2 to 10 parts by weight of the phosphorescent pigment (D) are included based on 100 parts by weight of the unsaturated polyester resin (A), and the silica-containing compound (B′) includes 20 to 28 wt% of silica powder (b1), based on total weight of the phosphorescent chips (II). According to the present invention, the resin-based engineered stone exhibits various surface textures according to illumination of lighting.
광투과성 모재(I) 및 축광칩(II)을 포함하고, 상기 광투과성 모재(I)는, 광투과성 모재(I) 총량에 대해, 불포화 폴리에스테르 수지(A) 7 중량% 내지 10 중량% 및 실리카 함유 화합물(B) 90 중량% 내지 93 중량%를 포함하고, 상기 광투과성 모재(I)는 상기 불포화 폴리에스테르 수지(A) 100 중량부에 대해 0.01 중량부 내지 0.05 중량부의 유/무기안료(C)를 더 포함하고, 상기 축광칩(II)은, 축광칩(II) 총량에 대해, 불포화 폴리에스테르 수지(A) 9 중량% 내지 12 중량%, 실리카 함유 화합물(B') 88 중량% 내지 91 중량% 및 축광안료(D)를 포함하고, 상기 축광안료(D)는 불포화 폴리에스테르 수지(A) 100 중량부에 대해 2 중량부 내지 10 중량부로 포함되고, 상기 실리카 함유 화합물(B')은 실리카 분말(b1)을 상기 축광칩(II) 총량에 대해 20 중량% 내지 28 중량%로 포함하는 강화 천연석 및 그 제조방법에 관한 것이다. |
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