RESIN COMPOSITION FOR ABRASIVE ARTICLE AND PAD PREPARED BY THE SAME
The present invention relates to a composition of a polishing body resin, capable of providing a bonding force difficult to separate a polishing body from a base by a frictional load or the like during processing, and providing capability to suppress deformation of the polishing body by an external...
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| creator | MOON, DEOG JU JO, SEONG WOOK |
| description | The present invention relates to a composition of a polishing body resin, capable of providing a bonding force difficult to separate a polishing body from a base by a frictional load or the like during processing, and providing capability to suppress deformation of the polishing body by an external force while ensuring minimum or more polishing/cleaning performance; and a pad manufactured thereby. According to the present invention, the composition of a polishing body resin, which is the composition of a polishing body that is attached on a base, comprises: 15 to 35 weight percent of trimethylolpropane (EO)n triacrylate (TMP(EO)nTA) monomer; and 20 to 60 weight percent of an acrylate based oligomer with a molecular weight of at least 2,500, wherein n is a natural number satisfying 6 |
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본 발명은 최소 이상의 연마/세정 성능을 확보할 수 있으면서, 동시에 공정 중 마찰 하중 등에 의해 연마체가 기재로부터 탈락되지 않을 정도의 고착력과 외력에 의한 연마체 변형이 억제 능력을 구현할 수 있는 연마체 수지 조성물에 관한 것이다. 본 발명에 따른 연마체 수지 조성물은 기재 상에 부착되는 연마체의 조성물로서, TMP(EO)nTA 모노머 15 ~ 35 중량%; 및 분자량이 적어도 2500인 아크릴레이트계 올리고머 20 ~ 60 중량%를 포함하고, 상기 TMP(EO)nTA에서 상기 'n'은 6≤n≤15를 만족하는 자연수인 것을 특징으로 한다. 그리고, 연마체 수지 조성물은 20 ~ 40 중량%의 이소보닐아크릴레이트(IBOA) 모노머를 더 포함할 수 있다. 그리고, 아크릴레이트계 올리고머는 1 ~ 6 관능기의 우레탄 아크릴레이트 올리고머 중에서 선택된 적어도 어느 하나를 포함하는 것을 특징으로 한다.</description><language>eng ; kor</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; POLISHING ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180629&DB=EPODOC&CC=KR&NR=20180072243A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180629&DB=EPODOC&CC=KR&NR=20180072243A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOON, DEOG JU</creatorcontrib><creatorcontrib>JO, SEONG WOOK</creatorcontrib><title>RESIN COMPOSITION FOR ABRASIVE ARTICLE AND PAD PREPARED BY THE SAME</title><description>The present invention relates to a composition of a polishing body resin, capable of providing a bonding force difficult to separate a polishing body from a base by a frictional load or the like during processing, and providing capability to suppress deformation of the polishing body by an external force while ensuring minimum or more polishing/cleaning performance; and a pad manufactured thereby. According to the present invention, the composition of a polishing body resin, which is the composition of a polishing body that is attached on a base, comprises: 15 to 35 weight percent of trimethylolpropane (EO)n triacrylate (TMP(EO)nTA) monomer; and 20 to 60 weight percent of an acrylate based oligomer with a molecular weight of at least 2,500, wherein n is a natural number satisfying 6 <= n <= 15. Moreover, the composition of a polishing body resin comprises 20 to 40 weight percent of an isobornyl acrylate (IBOA) monomer and the acrylate based oligomer includes at least one selected among urethane acrylate oligomers with 1 to 6 functional groups.
본 발명은 최소 이상의 연마/세정 성능을 확보할 수 있으면서, 동시에 공정 중 마찰 하중 등에 의해 연마체가 기재로부터 탈락되지 않을 정도의 고착력과 외력에 의한 연마체 변형이 억제 능력을 구현할 수 있는 연마체 수지 조성물에 관한 것이다. 본 발명에 따른 연마체 수지 조성물은 기재 상에 부착되는 연마체의 조성물로서, TMP(EO)nTA 모노머 15 ~ 35 중량%; 및 분자량이 적어도 2500인 아크릴레이트계 올리고머 20 ~ 60 중량%를 포함하고, 상기 TMP(EO)nTA에서 상기 'n'은 6≤n≤15를 만족하는 자연수인 것을 특징으로 한다. 그리고, 연마체 수지 조성물은 20 ~ 40 중량%의 이소보닐아크릴레이트(IBOA) 모노머를 더 포함할 수 있다. 그리고, 아크릴레이트계 올리고머는 1 ~ 6 관능기의 우레탄 아크릴레이트 올리고머 중에서 선택된 적어도 어느 하나를 포함하는 것을 특징으로 한다.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOcg329FNw9vcN8A_2DPH091Nw8w9ScHQKcgz2DHNVcAwK8XT2AdJ-LgoBjkAc5BrgGOTqouAUqRDi4aoQ7OjrysPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4r2DjAwMLQwMzI2MTIwdjYlTBQCyayvq</recordid><startdate>20180629</startdate><enddate>20180629</enddate><creator>MOON, DEOG JU</creator><creator>JO, SEONG WOOK</creator><scope>EVB</scope></search><sort><creationdate>20180629</creationdate><title>RESIN COMPOSITION FOR ABRASIVE ARTICLE AND PAD PREPARED BY THE SAME</title><author>MOON, DEOG JU ; JO, SEONG WOOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180072243A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2018</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MOON, DEOG JU</creatorcontrib><creatorcontrib>JO, SEONG WOOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOON, DEOG JU</au><au>JO, SEONG WOOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION FOR ABRASIVE ARTICLE AND PAD PREPARED BY THE SAME</title><date>2018-06-29</date><risdate>2018</risdate><abstract>The present invention relates to a composition of a polishing body resin, capable of providing a bonding force difficult to separate a polishing body from a base by a frictional load or the like during processing, and providing capability to suppress deformation of the polishing body by an external force while ensuring minimum or more polishing/cleaning performance; and a pad manufactured thereby. According to the present invention, the composition of a polishing body resin, which is the composition of a polishing body that is attached on a base, comprises: 15 to 35 weight percent of trimethylolpropane (EO)n triacrylate (TMP(EO)nTA) monomer; and 20 to 60 weight percent of an acrylate based oligomer with a molecular weight of at least 2,500, wherein n is a natural number satisfying 6 <= n <= 15. Moreover, the composition of a polishing body resin comprises 20 to 40 weight percent of an isobornyl acrylate (IBOA) monomer and the acrylate based oligomer includes at least one selected among urethane acrylate oligomers with 1 to 6 functional groups.
본 발명은 최소 이상의 연마/세정 성능을 확보할 수 있으면서, 동시에 공정 중 마찰 하중 등에 의해 연마체가 기재로부터 탈락되지 않을 정도의 고착력과 외력에 의한 연마체 변형이 억제 능력을 구현할 수 있는 연마체 수지 조성물에 관한 것이다. 본 발명에 따른 연마체 수지 조성물은 기재 상에 부착되는 연마체의 조성물로서, TMP(EO)nTA 모노머 15 ~ 35 중량%; 및 분자량이 적어도 2500인 아크릴레이트계 올리고머 20 ~ 60 중량%를 포함하고, 상기 TMP(EO)nTA에서 상기 'n'은 6≤n≤15를 만족하는 자연수인 것을 특징으로 한다. 그리고, 연마체 수지 조성물은 20 ~ 40 중량%의 이소보닐아크릴레이트(IBOA) 모노머를 더 포함할 수 있다. 그리고, 아크릴레이트계 올리고머는 1 ~ 6 관능기의 우레탄 아크릴레이트 올리고머 중에서 선택된 적어도 어느 하나를 포함하는 것을 특징으로 한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | RESIN COMPOSITION FOR ABRASIVE ARTICLE AND PAD PREPARED BY THE SAME |
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