RESIN COMPOSITION FOR ABRASIVE ARTICLE AND PAD PREPARED BY THE SAME

The present invention relates to a composition of a polishing body resin, capable of providing a bonding force difficult to separate a polishing body from a base by a frictional load or the like during processing, and providing capability to suppress deformation of the polishing body by an external...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MOON, DEOG JU, JO, SEONG WOOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a composition of a polishing body resin, capable of providing a bonding force difficult to separate a polishing body from a base by a frictional load or the like during processing, and providing capability to suppress deformation of the polishing body by an external force while ensuring minimum or more polishing/cleaning performance; and a pad manufactured thereby. According to the present invention, the composition of a polishing body resin, which is the composition of a polishing body that is attached on a base, comprises: 15 to 35 weight percent of trimethylolpropane (EO)n triacrylate (TMP(EO)nTA) monomer; and 20 to 60 weight percent of an acrylate based oligomer with a molecular weight of at least 2,500, wherein n is a natural number satisfying 6