SEMICONDUCTOR DEVICE AND METHOD MANUFACTURING THE SAME

A semiconductor device according to an embodiment of the present invention includes an n- type layer located on a first side of an n+ type silicon carbide substrate, a trench located in the n- type layer, a first gate electrode and a second gate electrode located in the trench and separated from eac...

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Bibliographische Detailangaben
1. Verfasser: CHUN, DAE HWAN
Format: Patent
Sprache:eng ; kor
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