COMPOSITION FOR FORMING SILICA LAYER METHOD FOR MANUFACTURING SILICA LAYER AND ELECTRIC DEVICE INCLUDIMG SILICA LAYER

The present invention relates to a composition for forming a silica film, containing a silica-containing polymer and a solvent. The weight average molecular weight of the silica-containing polymer is 2,000 to 100,000, and a branching rate (a) of the silica-containing polymer calculated by an equatio...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, YONG GOOG, SIM, SOO YEON, BAE, JIN HEE, KIM, JIN GYO, NOH, KUN BAE, LEE, JI HO, HWANG, BYEONG GYU, YUN, HUI CHAN, KWAK, TAEK SOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to a composition for forming a silica film, containing a silica-containing polymer and a solvent. The weight average molecular weight of the silica-containing polymer is 2,000 to 100,000, and a branching rate (a) of the silica-containing polymer calculated by an equation 1 is 0.25 to 0.50, wherein the equation 1 is represented by η=k·M^a. In the equation 1, η refers to an intrinsic viscosity of the silicon-containing polymer, M is the absolute molecular weight of the silicon-containing polymer, a is the branching rate, and k is a unique constant. 규소 함유 중합체, 그리고 용매를 포함하는 실리카 막 형성용 조성물로서, 상기 규소 함유 중합체의 중량평균분자량은 2,000 내지 100,000이고, 하기 식 1에 의거하여 산출한 상기 규소 함유 중합체의 분지율(a)이 0.25 내지 0.50인 실리카 막 형성용 조성물: [식 1] η=k·M상기 식 1에서, η은 규소 함유 중합체의 고유점도이고, M은 규소 함유 중합체의 절대분자량이고, ａ는 분지율이고, k는 고유상수이다.