AUTOMATIC MOLD DEVICE
The present invention relates to an automatic mold apparatus, comprising: a lower mold unit on which a material is seated; an upper mold unit disposed above the lower mold unit and configured to process the material while moving up and down, and to move the processed material upward; and an inversio...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | The present invention relates to an automatic mold apparatus, comprising: a lower mold unit on which a material is seated; an upper mold unit disposed above the lower mold unit and configured to process the material while moving up and down, and to move the processed material upward; and an inversion convey unit for holding the material attached to the upper mold unit, reversing the material, and moving the material to a next step. Therefore, the present invention can regulate burr directionality of the material.
본 발명은 자동화 금형장치에 관한 것으로, 소재가 안착되는 하금형부와, 하금형부의 상방에 배치되고 상하 이동되면서 소재를 가공하고, 가공된 소재를 상방 이동시키는 상금형부와, 상금형부에 부착된 소재를 파지하고 소재를 반전시켜 다음 공정으로 이동시키는 반전이송부를 포함하여, 소재의 버 방향성을 규제할 수 있다. |
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