SUBSTRATE MACHINING METHOD

The present invention relates to a method for processing a substrate, which is configured to prevent cracks from being generated in a glass substrate when a target mark is formed on front and rear surfaces of a substrate made of a glass substrate as a constituent material. In a substrate including a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YASUSHI ITO, KAORI TATEISHI, KENICHI ICHIKAWA
Format: Patent
Sprache:eng ; kor
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