Solder ball and embedded chip package of semiconductor using the same

The present invention relates to a solder ball used for an embedded chip package which comprises tin (Sn), silver (Ag), copper (Cu), nickel (Ni), palladium (Pd), bismuth (Bi), and indium (In). By adding a specific content of Ni, Pd, Bi, and In to a specific content of an SAC solder alloy in order to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	EUN, DONG JIN, CHUN, MYOUNG HO, LEE, HYUN KYU, BAE, SEONG MUN, PARK, EUN KWANG, KIM, SUNG TEK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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