SYSTEM FOR ADJUSTING RELATIVE POSITIONS BETWEEN COMPONENTS OF A BONDING APPARATUS

A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the fli...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANG LIANG HONG, WOO SHUI CHEUNG, LAM KUI KAM, CHEUNG WAI YUEN, YAU WAN YIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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